Highlights
- Ideal for machining of complex workpiece geometries in hard and brittle advanced materials like e. g. ceramics, glass, corundum, carbide or composites
- Up to 50% lower process forces due to ULTRASONIC
- Up to 40 % less sub-surface damage (SSD)
- Up to 3 times higher productivity
- Surface quality to Ra ≤ 0.1 µm is possible
- Integration via HSK interface. All standard machine features for milling / turning are possible.
Workpieces
Mirror support
- Zerodur
- Optical industry
- ø 400 × 150 mm
Wafer chuck
- SiC
- Semiconductor
- ø 300 × 6 mm
Blades
- Composite (CMC)
- Aerospace
- 50 × 150 × 195 mm
Indexable insert
- Carbide
- Tooling
- 15 × 20 × 8 mm
Facts
Actuator system of the latest generation with amplitudes down to ≤ 5 µm
- Flexible configuration
- ULTRASONIC drilling
- ULTRASONIC-grinding of ceramics, glass etc.
- ULTRASONIC 3rd Generation – optimal processes due to intelligent control
- Automatic frequency detection and tracking ULTRASONIC complete (as standard)
- Individual optimisation of machining strategies by amplitude regulation (ULTRASONIC programming cycle) or automatic feed adaptation (ULTRASONIC feed control option).
ULTRASONIC microDRILL
- Adaptive spindle with max. 32,000 rpm
- Use of hollow- or spiral-drills starting from ø 0.1 mm
- Automatic drilling force regulation (<1 N)
- ICS with up to 40 bar and volume flow monitoring
- Automatic ejector for drill cores (with hollow drills) to avoid tool breakage
ULTRASONIC axialGRINDING
Highly efficient grinding of rotationally symmetrical structures in hard and brittle materials in combination with direct drive C-axis (option)
ULTRASONIC microSCOPE
Camera-based workpiece alignment and detection of hidden contours or marks in transparent material, e. g. aligning a glass cylinder with two marks, ideal for the semiconductor and optical industries.
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